沉铜背光不良问题的改善  

Improvement to the defect of the plating the holes backlight

作　　者：肖云顺[1] 罗小明[1] 邓涛[1] 

机构地区：[1]株洲南车时代电气股份有限公司,湖南株洲412001

出　　处：《印制电路信息》2012年第11期28-31,共4页Printed Circuit Information

摘　　要：主要介绍了一直困扰印制电路沉铜生产工艺过程中频繁出现的背光不良问题的追踪改善情况,通过深入研究和探索,找到了问题的产生根源,制定了有效的改善措施,最终杜绝了背光不良问题的发生,稳定了沉铜工序的生产。This article introduced a problem about the PTH defect which had been traced and improved in PTH process.We found the problems source through into exploration,and worked out effective improvement step.Finally,we avoid PTH defect,stabilized PCB production in PTH process.

关 键 词：背光 负载量 管理管控 规范 表格 

分 类 号：TN41[电子电信—微电子学与固体电子学]