BGA和CCGA形位尺寸测试方法研究  

The Discussion on the Measurement of BGA and CCGA Geometrical Size

作　　者：杨轶博[1] 丁荣峥[1] 明雪飞[1] 陈波[1] 

机构地区：[1]中国电子科技集团公司第58研究所,江苏无锡214035

出　　处：《电子与封装》2012年第10期10-13,共4页Electronics & Packaging

基　　金：国家"核高基"重大专项(2011ZX01022-004)

摘　　要：BGA和CCGA电路焊球、焊柱的平面位置度、线性度以及PBGA翘曲度是封装检测的必检项目,其测量方法也较多。文章提出用激光测量显微镜来获取电路焊球球心、焊柱轴线的X-Y平面投影坐标,并结合AutoCAD软件,准确给出焊球/焊柱的平面位置度、线性度等,具有直观、快速、简便、精度高等特点,适合BGA和CCGA形位尺寸的在线检测、离线检验。Planar position, linearity and PBGA＇s warpage degree of BGA/CCGA are necessary terms for package inspection and measurement for which there are several methods. Laser microscope is employed to attain X-Y coordinate of ball center and column axis of BGA/CCGA. Auto CAD is also employed to plot and show Planar position, linearity of solder ball and solder column, which is effective and accurate, adapting to on-line measurement and off-line inspection.

关 键 词：BGA/PBGA CCGA 平面位置度 线性度 翘曲度 

分 类 号：TN305.94[电子电信—物理电子学]