小麦碾皮制粉各道碾皮状况的电镜观察与分析  

Scanning and Analysis on Debranning State in Debranned Wheat Flour Milling

作　　者：刘英[1] 孙英[1] 

机构地区：[1]武汉工业学院食品系,武汉430023

出　　处：《中国粮油学报》2000年第4期58-62,共5页Journal of the Chinese Cereals and Oils Association

摘　　要：对小麦碾皮制粉各道碾皮麦的横切面、纵切面及表面进行电镜观察 ,分析各道碾皮麦皮层去除状况 ,为小麦碾皮制粉技术中碾皮率的确定提供理论依据。原料为红皮软质春小麦 ,采用擦离与碾削相结合方式进行小麦碾皮。经过四道碾皮后 ,其碾皮率达到 5%。电镜扫描显示 :头两道碾皮主要碾除了麦粒的表皮以及部分内果皮、种皮。第三道碾皮主要碾除了麦粒的种皮及部分珠心层。经第四道碾皮后 ,除麦粒腹沟处有部分皮层未被碾除 ,麦粒表面大部分露出糊粉层 ,但未损伤胚乳。The debranning state of wheat grain,grain cross section,grain longitudinal section as well as grain surface,in each pass of wheat debranning were scanned with HITACH Scanning Electron Microscope S-450 and analysed,which offers a guide for laying down the debranning rate for debranned wheat flour milling.With the combination of frictional and abrasive debranning,the spring soft red wheat was debranned by 4 passes of debranning,with a total 5% debranning rate.The first two passes of debranning mainly debranned the cuticle and partially debranned the endocarp and episperm of wheat grain.The third pass debranned the episperm and a part of nucellar layer.After the forth debranning,only a little of cuticle at the crease was not debranned,most of the aleurone of wheat grain was exposed,but the endosperm of wheat grain was not demaged.

关 键 词：小麦 皮层 碾皮制粉 碾皮率 电镜观察 

分 类 号：TS211.4[轻工技术与工程—粮食、油脂及植物蛋白工程] TS210.1[轻工技术与工程—食品科学与工程]