IGBT模块封装新技术  

New Technology of IGBT Module Package

作　　者：姚玉双 亓笑妍 王晓宝[1] 赵善麒[1] 

机构地区：[1]江苏宏微科技股份有限公司,江苏常州213000

出　　处：《电力电子技术》2012年第12期39-41,共3页Power Electronics

摘　　要：近年来,市场对功率模块的需求是体积越来越小,可靠度越来越高。功率模块由很多种材料组成,主要需要克服的挑战是对于可靠性需求的迎合。这些新的需求将加强优化封装并克服原有封装的局限性。在此研究了影响模块可靠性的具体因素,并寻求提高模块可靠性的方法。温度循环是判断模块可靠性的重要参数之一,它受到模块的结构和材料的影响。为了提高模块的功率循环次数,可采取优化布局、铜键合、SKIN技术等方法;为提高模块的散热效率,可采取预涂导热硅脂、PIN-FIN散热底板等方法;为了简化模块安装,提高系统的可靠性,可采取Press FIT端子结构、单螺钉安装功率模块等技术。In recent years,power modules have widely been used in power electronics fields.As a result,the market demands smaller,more reliable modules.The power module consists of various kinds of materials and main challenges for such kinds are to meet the increased requirements of reliability.These new requirements may enforce adjustment in the utilized packaging technologies to overcome the given package limitations.This paper studies factors affecting relia- bility in power module, and makes power module structure with high reliability.Power module requires high reliability at thermal cycling, and it requires high efficiency too.The reliability of power module is affected by structure and ma- terials.This paper introduces the new packaging technologies.To improve the thermal cycling we can take these meth- ods such as optimizing layout, copper bonding, and SKIN technology and so on.To improve the efficiency of heat dis- sipation,PIN FIN heat sink and special coating of silicone thermal grease can be applied.Press FIT and a single screw installation technique can make the power module system more reliable.

关 键 词：晶体管 功率模块 温度循环 

分 类 号：TN32[电子电信—物理电子学]