时效Sn-0.3Ag-0.7Cu/OSP、ENIG焊点剪切强度的比较  

Comparative Analysis of Shear Strength of Sn-0.3Ag-0.7Cu/OSP、ENIG Solder Joints under Aging Conditions

作　　者：戴宗倍[1] 卫国强[1] 薛明阳[1] 师磊[1] 

机构地区：[1]华南理工大学机械与汽车工程学院

出　　处：《特种铸造及有色合金》2012年第12期1155-1158,共4页Special Casting & Nonferrous Alloys

摘　　要：研究了Sn-0.3Ag-0.7Cu钎料与有机防氧化涂层(OSP)及化学镀镍金镀层(ENIG)焊盘回流焊后焊点界面IMC和剪切强度在不同时效条件下的变化。结果表明,(1)随着时效时间的增加,两种焊盘的界面IMC厚度都增加,并且符合抛物线生长规律,但是OSP焊盘界面IMC生长速率要快于ENIG焊盘界面IMC的生长速率,其界面IMC的形貌逐渐平整;(2)OSP和ENIG焊盘焊点的剪切强度均随时效时间的延长而下降。在低温时效时,ENIG焊盘焊点的剪切强度高于OSP焊盘焊点的剪切强度;然而,在高温时效时,ENIG焊盘焊点的剪切强度却低于OSP焊盘焊点的剪切强度。Changes of the interracial IMC （intermetallic compound） morphologies and the shear strength of Sn-0.3Ag-0.7Cu/OSP, ENIG finishes solder joints were evaluated under different aging conditions. The results indi＇cate that： （1） The interfacial IMC thickness between the two type of finishes and Sn-0.3Ag-0.7Cu solder is increased with increasing in aging time, and the growth rule follows parabolic rule. However, the growth rate of the interracial IMC with OSP finish is higher than with ENIG finish, and the IMC morphologies gradually transform into the flat wave-shaped. （2） The shear strength of Sn-0.3Ag-0.7Cu/OSP, ENIG finishes solder joints is decreased with increasing in aging time. With ag- ing at lower temperature, the shear strength of the solder joint with ENIG finish is higher than that with OSP finish. However, the shear strength of the solder joint with ENIG finish is lower than that with OSP finish with aging at higher temperature.

关 键 词：SN-0 3Ag-0 7Cu钎料 OSP ENIG 时效 IMC形貌 剪切强度 

分 类 号：TG156.92[金属学及工艺—热处理]