SAC-Bi-Ni焊点抗热冲击及抗热时效性能研究  

Thermal shock and thermal aging performance of SAC-Bi-Ni solder joint

作　　者：李霞[1] 孙凤莲[1] 刘洋1985 刘洋1981 

机构地区：[1]哈尔滨理工大学精密焊接及微连接实验室,哈尔滨150080

出　　处：《中国体视学与图像分析》2012年第4期341-347,共7页Chinese Journal of Stereology and Image Analysis

基　　金：国家自然科学基金项目(51174069)

摘　　要：本文以高银钎料SAC305为对比,研究了低银SAC-Bi-Ni钎料分别与Cu和Ni焊盘形成的焊点抗热冲击及抗热时效性能。结果表明:热冲击前后SAC-Bi-Ni体钎料的硬度均比SAC305高。随着热冲击次数的增加,界面IMC层逐渐变厚,低银钎料SAC-Bi-Ni/Cu界面IMC层的厚度比高银钎料SAC305/Cu薄;热时效前后,SAC-Bi-Ni焊点的抗剪切强度均大于SAC305焊点。In this paper,the thermal shock and thermal aging resisitance of low silver SAC-Bi-Ni solder joints on Cu and Ni subtrates were investigated respectively compared with SAC305 ,the high silver solder. Experimental results revealed that the hardness of SAC-Bi-Ni was higher than that of SAC305 before and after thermal shock. With the increase of the number of times of the thermal shock, the thickness of the IMC layer increased gradually, Meanwhile, the thickness of the IMC layer of low silver SAC-Bi-Ni/Cu was thiner than that of high silver SAC305 / Cu; SAC-Bi-Ni of solder joint showed higher shear strength than SAC305 before and after thermal aging.

关 键 词：无铅钎料 热冲击 热时效 界面化合物 力学性能 

分 类 号：TG425.1[金属学及工艺—焊接]