低银焊料超声雾化制粉及焊膏性能研究  

Ultrasonic Atomization of Low Ag Lead-free Solder and Properties of Solder Paste

作　　者：倪广春 陈旭[2] 周健[2] 

机构地区：[1]金封焊宝有限责任公司,山东枣庄277800 [2]东南大学材料科学与工程学院,江苏南京211189

出　　处：《电子工艺技术》2013年第1期18-21,共4页Electronics Process Technology

摘　　要：在Sn-0.7Cu-0.1Ag低银焊料基础上进行微合金化,研究了Ag和Ni对钎料润湿性以及元素X对钎料润湿抗氧化性的影响,比较了超声波雾化法与气体雾化法制备焊锡粉的区别。结果表明:随着Ag含量增加,钎料合金的润湿力提高并且润湿时间减少。添加Ni元素,钎料润湿力并没有明显变化,润湿时间略有减小。高活性焊剂可以显著提高钎料润湿力,同时缩短润湿时间。在低银钎料中添加微量元素X,质量分数超过0.003%时,可以显著改善钎料抗氧化性能。采用超声波雾化法较气体雾化法制得的低银焊锡粉,异形粉比例明显下降。The influences of AO and Ni on wet ability and X on inoxidability of Sn-O.7Cu-0.1Ag low Ag lead-free solder were investigated. Differences of solder powders made by ultrasonic atomization and gas atomization process were also studied. Results show that the addition of Ag can improve the wetting force and reduce the wetting time. Wetting force did not change but the wetting time reduced slightly with the addition of Ni. Welding flux with high activity can both improve the wetting force and reduce the wetting time. The ability of oxidation resistance of solder alloys notably enhanced when the content of X increased to 0.003%. Compared with gas atomization process, less proportion of abnormity powders can be found in solder powders made by ultrasonic atomization process.

关 键 词：低银焊料 润湿性 抗氧化性 超声雾化 

分 类 号：TN604[电子电信—电路与系统]