LTCC电路加工中的关键技术分析  

Analysis of Key Technologies in LTCC Circuit Fabrication

作　　者：赵飞[1] 党元兰[1] 

机构地区：[1]中国电子科技集团公司第54研究所,河北石家庄050081

出　　处：《电子工艺技术》2013年第1期37-39,共3页Electronics Process Technology

摘　　要：LTCC电路是实现3D立体封装的有效形式之一,从LTCC电路的组成材料出发,概述了LTCC电路的特点及典型的生产流程,提出了LTCC电路加工中需要解决的问题,分析了加工中孔互连、印刷控制、层叠环境、烧结控制和腔体保护加工等关键技术以及不同加工方式对产品质量的影响。LTCC circuit is one of the effective forms of achieving 3D packaging. Starting from the materials which consist of the LTCC circuit, the fabrication procedure was illustrated. In order to solve the problems mentioned, some key technologies, such as via interconnection, control of screen printing, way of lamination, control of sintering, protection of cavity, were analyzed and the influences caused by different procedures were compared.

关 键 词：LTCC电路 通孔 丝网印刷 层叠 烧结 腔体 

分 类 号：TN45[电子电信—微电子学与固体电子学]