高精度微波印制电路工艺技术研究  

Research on High Precision Microwave Printed Circuit Technology

作　　者：林玉敏[1] 戴广乾[1] 边方胜[1] 

机构地区：[1]中国电子科技集团公司第二十九研究所,四川成都610036

出　　处：《电子机械工程》2013年第1期46-49,共4页Electro-Mechanical Engineering

摘　　要：随着微波印制电路产品向着体积小、重量轻、可靠性高和高密度互连(High Density Interconnec-tion,HDI)的趋势发展,其制造能力特别是高精度的制造工艺水平急需提升。文中简单介绍了微波印制电路对基材的要求,重点讨论了高精细线条、高精密对位及高精度外形铣切等关键工艺,分别通过螺旋面天线、耦合器和开关电路基片等典型样件的制造与测试,验证了工艺的可行性。结果显示,该工艺技术不仅可提高现有产品的微波性能,也为未来毫米波产品的发展奠定了一定的工艺基础。With the development trend of microwave printed circuit （MPC） products towards small volume, light weight, high reliability and high density interconnection （ HDI）, it is urgent to advance its manufacturing capability, especially the high precision MPC technology. The material requirements of MPC are simply intro- duced and the crucial technology of high precision line, high precision alignment and high precision milling are mainly discussed. Samples of spiral antenna, coupler and switch are made and tested to validate the feasi- bility of technology. The result shows that the high precision MPC technology can not only improve the micro- wave performance of the existing products, but also make a foundation for development of millimeter wave products.

关 键 词：高精细线条 掩膜对位 微波印制电路 

分 类 号：TN405[电子电信—微电子学与固体电子学]