利用银锡共晶键合技术的MEMS压力传感器气密封装  

MEMS Pressure Sensor Hermetic Packaging Using Ag-Sn Eutectic Bonding Technique

作　　者：陈继超[1,2] 赵湛[1] 杜利东[1] 刘启民[1,2] 肖丽[1,2] 

机构地区：[1]中国科学院电子学研究所传感技术国家重点实验室,北京100190 [2]中国科学院研究生院,北京100049

出　　处：《纳米技术与精密工程》2013年第2期174-178,共5页Nanotechnology and Precision Engineering

基　　金：国家重点基础研究发展计划(973计划)资助项目(2011CB302104)

摘　　要：为了提高MEMS压力传感器的气密封装效果,利用银锡(Ag-Sn)焊片共晶键合的方法实现封装.首先介绍了工艺流程,然后利用X射线能谱(EDX)和剪切强度分析对共晶键合的温度和时间参数进行了优化,接着对9组静载荷下的剪切强度、Ag-Sn合金分布和键合层断面做了对比分析,最后做了X光检测、氦泄漏率对比测试及MEMS压力传感器实际效果测试.实验结果表明,在温度为230℃、加热时间为15 min、静载荷范围为0.003 9 MPa～0.007 8 MPa时,MEMS压电传感器的平均剪切强度达到14.22 MPa～18.28 MPa,X光检测无明显空洞,氦泄漏率不超过5×10-4Pa.cm3/s,测试曲线表明线性度较好.The silver-tin（Ag-Sn） solder film based on eutectic bonding method was used to improve the hermetic package effect of MEMS pressure sensors. Firstly, the process flow was illustrated. Secondly, the parameters of temperature and heating time were optimized by energy dispersive X-rays spectro- scope （EDX） and shear strength test. Thirdly, the shear strength, Ag-Sn alloy distribution and bonding layer cross-section under 9 different static pressures were analyzed and compared. Finally, the X-rays test, helium leak rate contrast test and MEMS pressure sensor test curve were presented. The experi- mental results indicate that the good effect of MEMS pressure sensor would be achieved at 230 ℃, for 15 rain, when the static pressure was from 0.003 9 MPa to 0.007 8 MPa; the average shear strength is up to 14.22 MPa--18.28 MPa; X-ray scan figure shows that the bonding area is uniform without obvi- ous holes; the helium leak rate is not more than 5×10^-4Pa·cm3/s; and the test lines show that the lin- earity of MEMS pressure sensor is good.

关 键 词：共晶键合 气密封装 银锡焊片 

分 类 号：TN405[电子电信—微电子学与固体电子学]