夹具形状对硅抛光片表面质量的影响  

Effect of Jig Shape on Surface Quality of Silicon Polished Wafers

作　　者：杨洪星[1] 陈亚楠[1] 

机构地区：[1]中国电子科技集团公司第四十六研究所,天津300220

出　　处：《电子工艺技术》2013年第2期122-124,共3页Electronics Process Technology

摘　　要：在硅抛光片的清洗技术中,湿法清洗技术仍然是主流清洗技术。随着抛光片尺寸增大,传统的手工清洗方式和半自动清洗方式已经不适于大尺寸硅抛光片的清洗,因此全自动湿法清洗设备逐步在大尺寸硅抛光片清洗设备中占据主导地位。在湿法清洗工艺中,夹具形状对清洗槽中液体的流动有着较大的影响,若夹具形状设计不合理,将影响抛光片表面沾污的去除,在抛光片表面形成"色斑"缺陷。In the silicon wafer cleaning technology, wet cleaning technology is still the mainstream cleaning technology. With the polishing sheet size increases, the traditional manual cleaning methods and semi automatic cleaning method is not suitable for large size silicon wafer cleaning, thus automatic wet cleaning equipment occupies the main position gradually in large size silicon wafer cleaning. In the wet cleaning process, jig shape has a greater impact on the flow of the liquid in the cleaning tank, if the jig shape design is unreasonable, the stain defect would be observed on the nolishp.d wAfp.r.~

关 键 词：硅抛光片 夹具形状 清洗技术 色斑 

分 类 号：TN605[电子电信—电路与系统]