玻璃覆晶封装中导电粒子弹性模量对节点电阻的影响  

Effect of Particle's Young Modulus on Joint's Resistance in COG Packaging

作　　者：陈显才[1] 陶波[1] 尹周平[1] 

机构地区：[1]华中科技大学数字制造装备与技术国家重点实验室,武汉430074

出　　处：《中国机械工程》2013年第7期932-936,共5页China Mechanical Engineering

基　　金：国家自然科学基金资助项目(91023033);教育部新世纪优秀人才计划资助项目(NCET-10-0414);广东省省部产学研结合项目(2010A090200009)

摘　　要：玻璃覆晶(COG)封装中,导电粒子的非线性力学行为对封装节点的电性能精确建模提出了挑战。提出了一种结合内聚力模型的位移-静电场顺序耦合方法,分析了玻璃覆晶封装中不同弹性模量导电粒子在键合压力和温度共同作用下的破裂与接触行为,探讨了节点电阻的形成机理与非线性变化规律,揭示了导电粒子弹性模量对节点电阻和机械可靠性的影响规律,进而提出了导电粒子最优弹性模量范围。研究结果表明:当弹性模量较小时,导电粒子与凸点/焊盘的接触面为圆环,使得节点电阻过大;随着弹性模量的逐渐增大,接触面会变为实心圆,但封装节点机械可靠性变差。This paper presented a structure-electric field coupling method with the cohesive model to analyze the contact and fracture of a conductive particle in COG packaging.Meanwhile,the electric conduction mechanism of COG was also investigated.The results show that the effect of particle＇s Young modulus on the mechanical and electrical properties of COG packaging is very significant.When the Young modulus is small,the contact surface between the particles and bump/pad is just a circle ring and it makes the joint resistance too large.However,when the Young modulus is large enough,the contact surface will become a circle.In this case,the resistance will be smaller a lot,but the greater bonding pressure should be loaded so that the mechanical reliability will become worse.

关 键 词：玻璃覆晶 各向异性导电膜 内聚力模型 接触电阻 多物理场耦合 

分 类 号：TN603[电子电信—电路与系统]