特种微机电系统压力传感器  

Special Micro-electro-mechanical Systems Pressure Sensor

作　　者：蒋庄德[1] 田边[1] 赵玉龙[1] 赵立波[1] 

机构地区：[1]西安交通大学机械制造系统工程国家重点实验室,西安710049

出　　处：《机械工程学报》2013年第6期187-197,共11页Journal of Mechanical Engineering

基　　金：国家自然科学基金(90923001);国家科技重大专项(2011ZX04004-061);高等学校学科创新引智计划(B12016);教育部科学技术研究重大(311001);长江学者和创新团队发展计划(IRT1033)资助项目

摘　　要：通过对微机电系统(Micro-electro-mechanical systems,MEMS)压力传感器设计方法与封装制作工艺问题的研究,针对不同应用环境下对压力传感器的性能、尺寸及封装要求,提出相应的传感器力学结构模型——微压结构、梁膜结构及倒杯结构,通过相应的FEM有限元建模方法对传感器结构进行仿真分析并优化结构尺寸,建立合理的力学结构;进行MEMS工艺设计及封装工艺满足传感器微小尺寸、耐高温冲击响应及高过载能力等要求。其中,针对微压传感器在测量过程中高灵敏度与非线性矛盾问题进行力学分析及仿真,分析不同结构的传感器的力学特性及结构尺寸对传感器输出特性的影响,提出新型梁膜结构微压传感器结构,对新型结构传感器进行MEMS工艺研究;根据空气动力学试验、航空测试及火药爆破试验等对高温压力传感器的动态特性要求,采用倒杯式高频响压力传感器及齐平膜封装方式,提高传感器的动态响应特性,满足10 kHz到1 MHz的频响要求;通过有限元分析耐高温冲击封装结构,采用梁膜封装结构提高了耐高温压力传感器的可靠性。通过压力传感器仿真验证、静态特性试验及动态冲击响应试验验证传感器力学结构建模方法、MEMS工艺设计及封装设计的正确性。Researcher focused on the study of design, package, and fabrication for MEMS pressure sensor. For the request of different applying environment, relative mechanics structures have been come up, including micro pressure, beam-membrane, and flush structure. All structures are established and simulated; the parameters of dimensions are confirmed after optimized design. The process of fabrication and package are set up for minimize sensor size, bearing high temperature shock and performing high frequency response. Among those researches, a new beam-membrane structure is proposed for micro pressure measurement and this structure could decrease the contradiction between sensitivity and nonlinearity through adopting appropriate dimensions; the flush structure is designed for high frequency pressure measurement, especially for aerodynamics, aviation, and exploding test, which need 10 kHz to 1 MHz; the reliability would be improved by beam-membrane package structure for ultra-high temperature shock application, which has been simulated and confirmed through structure simulating. The performances have been tested, confirmed and compared, including simulations, statics testament and dynamic response experiments; the results show the corrections for each sensor design, setting model and fabrication process previous.

关 键 词：微机电系统 压力传感器 封装 微型 倒杯 梁膜 

分 类 号：TG156[金属学及工艺—热处理]