基于厚膜混合集成电路的激光调阻工艺研究  

Study on the Laser Trimming Process of Thick Film Hybrid Integration Circuit

作　　者：王姜伙[1] 王志勤[1] 

机构地区：[1]中国电子科技集团公司第38研究所,合肥230088

出　　处：《电子与封装》2012年第11期34-36,共3页Electronics & Packaging

基　　金：装备预先研究项目(51318070119)

摘　　要：激光调阻具有高精度、高效率等特点,是目前厚膜混合集成电路最为常用的电阻修调方法。为了实现厚膜混合集成电路中精度电阻的制作,文章对激光调阻工艺进行了系统研究,内容包括探针卡焊接组装、调阻程序编制以及工艺试验研究。通过进行试验验证,选用L型调阻路径,调阻精度已达到±0.5%,满足设计要求。Laser trimming is a high precision and efficiency method of trimming the resistors, which has been used popular in the thick film hybrid integration circuit presently. In order to achieve the high precision resistors, the process of laser trimming method has been studied in this paper. The process of laser trimming includes soldering the probe card, compiling the program and studying the process experiments. Based on the several experiments study, the precision of L-cut type method is about ±0.5%.

关 键 词：激光调阻 探针卡焊接 调阻程序编制 工艺试验研究 

分 类 号：TP216[自动化与计算机技术—检测技术与自动化装置]