JBQ-3200型全自动金属膜剥离清洗系统研制技术  

The Techniques of the JBQ-3200 Metal Lift-Off System

作　　者：陈仲武[1] 宋文超[1] 张伟锋[1] 刘永进[1] 

机构地区：[1]中国电子科技集团公司第四十五研究所,北京101601

出　　处：《电子工业专用设备》2013年第4期49-54,共6页Equipment for Electronic Products Manufacturing

摘　　要：主要介绍了JBQ-3200型全自动金属膜剥离清洗系统设备功能、用途、结构组成、性能指标、主要特点,以及解决的关键技术和应用,能自动完成厚度在0.25～0.7 mm的准100～准200 mm具有基准边的标准圆片微细图形金属膜剥离、清洗和甩干工艺,剥离线宽能做到0.35μm以上,是声表面波(SAW)器件、GaAs微波、毫米波器件、MEMS器件、OLED器件和先进封装等器件制造工艺中的关键设备。In this paper, the JBQ-3200 Automatic Metal Lift-Off System is introduced, including its functions, usage, structure, performance parameters, main characteristics, key techniques and applications. The JBQ-3200 Automatic Metal Lift-Off System can be used in metal lift-off process, wafer clean process and wafer drying process for wafer 0.25-0.7 mm in thickness and 100-200 mm in diameter. The system can reach a peeling line width 0.35μm. The JBQ-3200 Automatic Metal Lift-Off System is a key machine which can be used in the manufacturing of SAW device, GaAs microwave and millimeter-wave device, MEMS device, OLED device, advanced packaging and so on.

关 键 词：金属膜剥离 自动传输系统 剥离清洗腔体 CCD中心定位 电气控制 软件系统 

分 类 号：TN305[电子电信—物理电子学]