BGA返修植球的优化方案  

An Optimizing Project of BGA Reballing

作　　者：李欢 苏凡 曾群 

机构地区：[1]红外技术股份有限公司,云南昆明650215

出　　处：《云光技术》2013年第1期13-19,共7页

摘　　要：BGA（BallGridArray）一球状引脚栅格阵列封装技术已在行业内广范使用，生产及研发过程中，出于设计或焊接不良的原因，BGA芯片的返修也随之增加。BGA植球技术做为返修过程中的关键环节，其质量直接影响到整个返修过程和芯片性能。本文通过试验，对植球工艺的关键因素进行分析控制，优化返修BGA芯片的植球过程，以得出一种经济、便于操作又可以保证返修质量的方案。With the popularity of Ball Grid Array technology, the number of BGA re-welding is improved due to design or bad soldering problems. As a critical link in the whole re-welding process, reballing quality is highly influent to both the quality and performance of the re-welded chips, by the method of orthogonal experiment, this essay is analysed the major elements of bumping process, in order to find out a procedure for reballing which is economy and easy to operate under our existing conditions.

关 键 词：BGA 返修 植球 正交实验法 共面性 

分 类 号：TN405.94[电子电信—微电子学与固体电子学]