高速光接收组件同轴结构封装关键技术研究  

Research on Key Technology of High-Speed Receiver Optical Sub-Assembly with Transistor Outline Package

作　　者：黄长统[1] 柴广跃[1] 彭文达[1] 郑启飞 

机构地区：[1]深圳大学光电子器件与系统国家重点实验室,广东深圳518060 [2]深圳市恒宝通光电子技术有限公司,广东深圳518060

出　　处：《半导体技术》2013年第5期383-387,共5页Semiconductor Technology

摘　　要：在接入网中,低成本、小尺寸的同轴结构封装10 Gb/s光接收组件起着非常重要的作用。在微波频段,封装器件引入的寄生参数已经成为制约其高频特性的主要因素之一。基于传输线理论,建立了包含芯片、金丝、管座的小信号等效电路模型。等效电路元件与实际封装器件有对应的关系。组件高频特性随元件参数值变化而变化。仿真结果表明金丝对其高频特性影响很严重。为了减小金丝电感,提出一种优化方案。并结合实际工艺条件,制作了样品,实验结果表明该样品的传输速率达到10 Gb/s,满足10 Gb/s光网络传输的要求。A 10 Gb/s receiver optical sub-assembly with transistor outline package plays an important role in the access network due to the attractive characteristics of low cost and small size. Its high-frequency characteristics are limited by the parasitic parameters of the packaging devices at microwave frequency bands. Based on the transmission line theory, a small signal equivalent circuit model including the chip, bonding wire and header were established. The elements of the equivalent circuit correspond to the practical packaging devices. The high-frequency characteristics of the receiver optical sub-assembly vary with the values of the elements. The simulation results show that the bonding wire becomes a serious effect on the high-frequency characteristics. In order to reduce the inductance of the bonding wire, an optimal solution was proposed. In considering a practical situation, a prototype was fabricated. The measurement result shows that the data rate is up to 10 Gb/s. Therefore, the proposed receiver optical sub-assembly can meet the requirements for the 10 Gb/s optical network transmission.

关 键 词：同轴结构封装 10Gb s光接收组件 寄生参数 小信号等效电路模型 高频特性 

分 类 号：TN305.94[电子电信—物理电子学]