高导热挠性铝基覆铜板用环氧胶粘剂的研究  

Research of epoxy adhesive for flexible Al-based copper clad laminate with high thermal conductivity

作　　者：李桢林[1] 严辉[1] 张雪平[1] 韩志慧[1] 杨志兰[2] 范和平[2] 

机构地区：[1]华烁科技股份有限公司,武汉430074 [2]江汉大学化环学院,武汉430056

出　　处：《印制电路信息》2013年第5期100-103,共4页Printed Circuit Information

摘　　要：采用高导热填料球形氧化铝填充环氧胶粘剂,并添加了适量离子捕捉剂有效地控制有害离子的离子迁移,利用该胶粘剂粘接铝箔和铜箔制备成挠性铝基覆铜板。文章中探讨了环氧胶粘剂的热固化温度和时间、球形氧化铝含量对胶膜热导率的影响,通过显微镜测试了导热填料在胶粘剂中的分散均匀性,最后确定最优配方制备出一种综合性能优异的挠性铝基覆铜板。Using high thermal conductivity filler-spherical alumina filled epoxy adhesive, adding appropriate amount of ion trapping agent to effectively control the migration of harmful ion, with the adhesive bonding of aluminum foil and copper foil, the flexible Al-based copper clad laminate was prepared. The paper discussed the curing temperature and time of epoxy adhesive and the conductivity effects of spherical alumina content on adhesive film. Through the microscope the dispersion uniformity of thermal, the conductivity filler in adhesive was tested. Finally a flexible Al-based copper clad laminate with excellent comprehensive performance was prepared by determined the optimal formula.

关 键 词：挠性铝基覆铜板 球形氧化铝 高导热 

分 类 号：TN41[电子电信—微电子学与固体电子学]