Au80Sn20合金焊料的制备及应用研究进展  

Research Progress in Preparation and Application of Au80Sn20 Solder Alloy

作　　者：刘文胜[1] 黄宇峰[1] 马运柱[1] 

机构地区：[1]中南大学粉末冶金国家重点实验室,长沙410083

出　　处：《材料导报》2013年第11期1-6,共6页Materials Reports

基　　金：国家863高技术项目(2012AA03A704);教育部长江学者特聘教授奖励基金

摘　　要：含有80%金和20%锡(质量分数)的Au80Sn20合金焊料因其高熔点及免助焊剂等性能而被广泛应用于光电子封装和微电子封装领域。综述了Au80Sn20合金焊料的性能,分析了金锡叠层法、熔铸法、电镀沉积法和机械合金化法制备Au80Sn20合金焊料的工艺原理和特点,介绍了Au80Sn20合金焊料在气密封盖、管壳焊接及芯片封装等领域的焊接技术和应用情况,最后指出了Au80Sn20合金焊料的研究方向和应用前景。The Au8OSn20 solder alloy containing 80 wt% gold and 20 wt% tin is widely used in the areas of optoelectronie packaging and microeleetronic packaging due to its high melting point, free-flux and other properties. The properties of Au80Sn20 solder alloy are summarized, and the technical principle and characteristics of the methods to prepare AuSOSn20 solder alloy by gold-tin laminating, melting-casting, eleetroplating deposition, and mechanical allo- ying are also analyzed. The welding technologies and applications of AuSOSn20 solder alloy in the fields of gas sealing cover, shell and tube welding, and chip packaging are introduced. The research directions and application prospects of Au80Sn20 solder alloy are forecasted finally.

关 键 词：Au80Sn20合金焊料 微电子封装 光电子封装 界面反应 制备技术 

分 类 号：TN305.94[电子电信—物理电子学]