高频声表面波器件用压电晶圆清洗技术研究  

Study on the Cleaning Technique of Piezoelectric Wafer for SAW Device with High Frequency

作　　者：刘善群[1] 汤旭东[1] 喻卫兵[1] 陶玲[1] 伍平[1] 刘晓莉[1] 陆川[1] 赵雪梅[1] 

机构地区：[1]中国电子科技集团公司第26研究所,重庆400060

出　　处：《压电与声光》2013年第3期318-319,328,共3页Piezoelectrics & Acoustooptics

摘　　要：论述了低浓度碱性过氧化氢清洗液兆声清洗钽酸锂、铌酸锂和水晶等压电晶圆的工艺技术。在保持压电晶圆特性的前提下,该技术可有效去除晶圆表面小于0.2μm的附着颗粒,使其表面洁净度满足亚微米线宽高频声表面波(SAW)器件生产要求,同时降低了化学品、去离子水的消耗量及对环境的污染。The megasonic cleaning technique using the alkaline hydrogen peroxide solution with light concentra- tion to clean the piezoelectric wafers such as LiTaO3, LiNbO3 and quartz has been presented in this paper. The par- ticles with size of less than 0.2μm adhered to the surface of the wafer can be removed effectively by using this tech- nique without damaging the characteristics of the piezoelectric wafers. The surface cleanliness of the wafer can satis- fy the mass-production requirements for high frequency SAW devices with submicron line-width while the consump- tion quantities of chemical products and deionized water can be cut down as well as the circumstance pollution risk can be reduced.

关 键 词：声表面波工艺 兆声清洗 压电晶圆 

分 类 号：TN804[电子电信—信息与通信工程]