覆铜板基材密度及其树脂密度的测试与改进  

作　　者：刘申兴[1,2] 朱泳名 钟廷宝[1,2] 

机构地区：[1]国家电子电路基材工程技术研究中心 [2]广东生益科技股份有限公司

出　　处：《覆铜板资讯》2013年第3期44-46,28,共4页Copper Clad Laminate Information

摘　　要：本文介绍了覆铜板基材的密度及其树脂密度的测试方法与改进。使用了简单的物理现象浮力的排水法,将基材的体积作为过渡量,只需称量样品在空气中与在水中的质量便可得到基材的密度;同时如果知道板材的玻璃布配本,便可进一步得到基材内树脂的密度。由于测量样品在水中的质量时,会带入气泡,通过减少带入的气泡便可减小误差,提高密度的测试精度。This article describes the test method and improvement of the CCL substrate＇s density and resin density. The method uses simple physical phenomenon drainage of the buoyancy, the volume of the substrate as the intermediate quantity, and simply weighing the quality of the samples in the air and also in the water, then can obtain the density of the substrate. If we know the lay-up of the glass fabric, we can also calculate the resin density. When weighing the samples in the water, the air bubbles may stick to the samples, we can reduce the deviation by reducing the air bubbles sticking on the sample, and then the test accuracy of the density improved.

关 键 词：覆铜板基材 密度 气泡 

分 类 号：TN41[电子电信—微电子学与固体电子学]