电子束蒸发工艺中源飞溅的控制  

Source Spatter Control in the Process of Electron Beam Evaporation

作　　者：李云海 张益平 章文 

机构地区：[1]无锡中微高科电子有限公司,江苏无锡214035

出　　处：《电子与封装》2013年第6期7-9,32,共4页Electronics & Packaging

摘　　要：采用电子束蒸发进行的背面金属化工艺中遇到的较为常见的问题,就是在蒸发过程中发生的蒸发源飞溅状况。这是影响工艺可靠性及稳定性的重要问题,如何通过工艺控制手段减少甚至杜绝此类问题的出现对实际生产是很有指导性意义的。文中对该问题产生的原因进行分析并展开讨论,并提出了相关控制措施。Using electron beam evaporation to the back metallization process, the common problem is source spatter happened in the process of evaporation. This is one of the most important problem affecting process reliability and stability. How to use process control means to reduce or even eliminate such problems is great guiding significance to practical production. In this paper, the cause of this problem is analyzed and discussed, and control measures are also put forward.

关 键 词：背面金属化 电子束 源飞溅 

分 类 号：TN305.94[电子电信—物理电子学]