LED键合压力控制系统的研究与设计  

Research and Design for Bonding Pressure Controlling System

作　　者：陈完年 王天雷[2] 王艳宾 王大承[2] 

机构地区：[1]广东科杰机械自动化有限公司,广东江门529030 [2]五邑大学机电学院,广东江门529020

出　　处：《组合机床与自动化加工技术》2013年第6期62-64,67,共4页Modular Machine Tool & Automatic Manufacturing Technique

基　　金：广东省重点科技资助项目(201110)

摘　　要：以LED全自动金线球焊线机键合压力的控制为研究对象,利用运动控制卡、伺服电机、伺服电机驱动器、光栅尺组建了位置闭环对劈刀的位置进行控制;利用单片机、数字电位器、电磁铁、压力传感器组建了压力闭环对键合压力进行控制。采用位置闭环和压力闭环相结合的方法设计了LED全自动金线球焊线机键合压力控制系统。目前阶段得到的实验结果表明:该控制系统相对比较稳定,能够减小因为超调带来的焊接基片损坏的现象。Aiming at bonding pressure of gold line ball welder used in the field of LED, this paper introduces a bonding pressure control system which is composed of position closed loop and pressure closed loop. The position closed loop which is used to control the position of cleaver consists of motion control card, servo motor, servo motor drive, grating ruler. The pressure closed loop which is used to control the bonding pressure consists of single - chip microcomputer and digital potentiometer, electromagnet, pressure sensor. At present, experimental results show that this control system is relatively stable as well as reduces the damage phenomenon of welding substrate which is caused by overshoot.

关 键 词：变参数 PID 压力 键合 

分 类 号：TH16[机械工程—机械制造及自动化] TG65[金属学及工艺—金属切削加工及机床]