超支化聚苯基硅树脂改性封装用环氧树脂研究  

Research of Hyper Branched Polyphenyl Silicone Resin Modified Epoxy for Electronic Packaging

作　　者：李良海 葛秋玲 李宗亚 

机构地区：[1]无锡中微高科电子有限公司,江苏无锡214035

出　　处：《电子与封装》2013年第7期1-4,11,共5页Electronics & Packaging

摘　　要：文中通过合成超支化的聚苯基硅树脂体系,对环氧树脂进行改性,以提升其介电、耐湿、耐热和力学性能。研究表明,超支化聚苯基硅树脂体系（HBPSi）的加入量在0~10wt%时,改性后的树脂体系介电、耐湿、耐热和力学性能随着HBPSi增加而提升;而在大于10wt%时,其性能的提升减缓。产生这种结果主要归因于一方面HBPSi与EP中的羟基反应,消耗了环氧树脂体系的羟基,另一方面是引入了大量的柔性硅氧链节。In this paper,a novel hyperbranched phenyl silicone resin（HBPSi）was prepared,which was used to modify Epoxy resin（EP）.Tests results showed that when the contents of HBPSi were in the range of 0~10wt%,modified EP presents better properties as contents raise more;when the contents were more than 10wt%,properties of Epoxy resin increased slowly.This result is mainly attributed to the reaction of HBPSi and hydroxyl of EP,at the same time,Number of silicon-oxygen chains were grafted to the EP.

关 键 词：环氧树脂 有机硅树脂 改性 封装材料 

分 类 号：TN305.94[电子电信—物理电子学]