基于红外热像图的电路板卡多芯片提取的研究  

Rsearch of Multi-chip Extraction of the Circuit Board Based on Infrared Thermal

作　　者：王力[1] 高博[1] 曾佩佩[1] 

机构地区：[1]中国民航大学航空自动化学院,天津300300

出　　处：《计算机测量与控制》2013年第7期1905-1907,共3页Computer Measurement &Control

摘　　要：针对机载电子线路板卡红外热像图中提取多目标芯片位置的问题,综合采用区域生长算法和二维OTSU算法完成多目标提取任务,为芯片排列复杂的电路板红外热像图的分割提出了一种有效的解决方案,为后续利用芯片的温度特征来实现板卡芯片级的故障检测与诊断提供了必须的保证;实验结果表明,可以准确地完成板卡上芯片的精确定位(剔除热辐射区域,仅仅保留芯片的核心发热区域),这种方法针对电路板卡红外热像图的多目标提取具有很高的准确性和完整性。To extract the multi-objective chip position from the infrared thermography of the Airborne electronic circuit boards, it syn- thetically adopts region growing algorithm and two-dimensional OTSU algorithm, which presents an effective infrared thermography parti- tion of intricately permutated circuit board, and provides assurance to the followed fault detection on the board and ship level using the fea- ture of the temperature of the chips. The experimental results show that this method is of high accuracy and completeness in object extrac tion of circuit boards＇ infrared thermography.

关 键 词：电子线路板卡 红外热像图 区域生长算法 OTSU算法 图像分割 

分 类 号：TP301[自动化与计算机技术—计算机系统结构]