脉冲电沉积高速Ni工艺研究  

High Speed Pulse Electro Plating Process of Nickel

作　　者：张午花[1] 费敬银[1] 骆立立[1] 林西华[1] 

机构地区：[1]西北工业大学理学院,西安710129

出　　处：《中国腐蚀与防护学报》2013年第4期317-324,共8页Journal of Chinese Society For Corrosion and Protection

摘　　要：研究了高速Ni镀液在脉冲电沉积条件下,工艺参数对Ni镀层的沉积速率、内应力、孔隙率及微观形貌等方面的影响规律。结果表明,温度、平均电流密度、频率、逆向脉冲系数及占空比对镀层性能和微观形貌有较大影响。与常规电沉积Ni方法相比,脉冲电沉积高速Ni还具有高效、节能等特点。The influences of pulse electroplating parameters on deposition rate, internal stress, po- rosity and microstructure of high speed nickel coating were studied. The results showed that the temperature, average current density, frequency, reverse pulse coefficient and duty cycle had great impact on the microstructure of coatings. Compared with the conventional method of electrodeposi- tion of nickel, high speed pulse electrodeposition of nickel had the advantages of high efficiency, energy saving and so on.

关 键 词：脉冲电沉积 镀镍 高速电镀 

分 类 号：TG153[金属学及工艺—热处理]