小型化功率放大模块  

Miniture power amplifier module

作　　者：赵夕彬[1] 

机构地区：[1]信息产业部电子13所,河北石家庄050051

出　　处：《半导体技术》2000年第6期37-38,共2页Semiconductor Technology

摘　　要：介绍了ＶＨＦ频段小型化功率放大模块的设计方法和试验研制过程，采用混合集成电路技术，将两级芯片集成到微型封装的密封管壳中，采用内匹配技术，实现阻抗匹配，提高和改善增益。在 １３０～１８０ＭＨｚ率范围内，试制出Ｇｐ≥３０ｄＢ，Ｐｏ≥１．５Ｗ，л≥５０％的功率放大模块。功率放大模块的体积为１５ｍｍｘ１０ｍｍｘ５ｍｍ，其质量只有 ３克。In this paper, the design method and the process of research on miniature power amplifier module in VHF band are specified. Some chips are integrated into a miniature ceramics closedpackage by means of the technique of hybrid integrated circuit (HIC). The impedance matching and gain improved by adopting the technique of intermatching are completed. Power amplifier module is achieved in the 130 ～180 MHz frequency, the gain is over 30dB,output power is over 1.5W, and efficiency is over 50%, The size is 15mm×10mm×5mm, and the weight is only 3 g.

关 键 词：混合集成电路 内匹配 模块 功率放大器 

分 类 号：TN722.75[电子电信—电路与系统]