轧制温度和变形量对Mo85-Cu复合材料组织和物理性能的影响  

Effects of rolling temperature and deformation on microstructure and thermal-physical properties of Mo85-Cu composite

作　　者：古一[1] 姜国圣[1] 王志法[1] 曾凡浩[2] 

机构地区：[1]中南大学材料科学与工程学院,长沙410083 [2]中南大学粉末冶金国家重点实验室,长沙410083

出　　处：《粉末冶金材料科学与工程》2013年第4期527-531,共5页Materials Science and Engineering of Powder Metallurgy

基　　金：军工配套项目(MKPT-05-343);粉末冶金国家重点实验室开放课题

摘　　要：采用熔渗法制备Mo85-Cu复合材料,通过SEM、DSC和热导仪研究轧制温度和轧制变形量对其微观组织和物理性能的影响。实验结果表明:该轧制工艺适宜于钼铜合金的工业化生产,一定范围内轧制变形量的增大有利于提高钼铜材料的致密度,改善钼铜合金的物理性能;经600℃轧制比350℃轧制的Mo85-Cu复合材料综合性能优异,与350℃轧制相比,600℃轧制的Mo85-Cu的热导率由164.1 W·m 1·K 1提高到173.7 W·m 1·K 1,气密性由5.4×10 9Pa·m3·s 1提高到3.4×10 9Pa·m3·s 1,整体密度由9.76 g/cm3提高到9.86 g/cm3,各项性能指标均满足电子封装材料产品要求。The Mo85-Cu composites were prepared by infiltration method and the effects of rolling temperature and deformation rate on the thermophysical properties and microstructure of the Mo85-Cu composites were investigated by SEM,DSC and conductance instrument.It is found that the density of Mo85-Cu composites increases with increasing the deformation rate in certain range.When the rolling temperature increases from 350 ℃ to 600 ℃,the thermal-physical properties of the composites improves,such as the thermal conductivity increases from 164.1 W·m 1·K 1to 173.7 W·m 1·K 1,the airtightness and the density increase from 5.4×10 9Pa·m3·s 1to 3.4×10 9Pa·m3·s 1,and from 9.76 g/cm3to 9.86 g/cm3,respectively.The results show that the performance parameters of the composites can meet the requirements of the electronic packaging materials.

关 键 词：Mo85-Cu 电子封装材料 轧制 物理性能 

分 类 号：TG139.7[一般工业技术—材料科学与工程]