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出 处:《重庆邮电大学学报(自然科学版)》2013年第5期634-638,共5页Journal of Chongqing University of Posts and Telecommunications(Natural Science Edition)
基 金:重庆市科委科技攻关计划项目(CSTC;2010AC2142)~~
摘 要:针对常规半导体放电管在超大浪涌电流作用下,易局部过热而损坏这一问题,采用镓闭管扩散代替硼扩散、台面工艺解决二氧化硅不能掩蔽镓扩散所带来的问题、玻璃钝化工艺实现高压结面保护等方法。实验结果表明,通过镓扩散、台面刻槽、玻璃钝化和钛镍银多层金属化等工艺,提高了放电管的启动保护电压和最大浪涌电流,其最大浪涌电流达到6 kA,比设计值5 kA提高了20%。In this paper, in order to solve the problem that the traditional arrester is easy to be damaged due to partial bver- heating when the arrester works with a high surge current, gallium is used instead of boron under closed ampoule vacuum diffusion; mesa technology is used to solve the problem caused by gallium diffusion which cannot be masked by silicon diox- ide ; glass passivation technology is used to protect junction surface under high voltage. Experimental results show that tech- nologies including gallium diffusion, mesa technology, glass passivation, and titanium-nickel-silver multilayer metalliza- tion, definitely improved the break-over voltage and the maximum transient surge cmTent of semiconductor arresters. More specifically, the maximum transient surge current reaches 6 kA which is 20% higher than the design value 5 kA.
关 键 词:高压大电流 半导体放电管 镓扩散 台面工艺 玻璃钝化
分 类 号:TN342.3[电子电信—物理电子学]
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