无铅焊料用水基免清洗助焊剂的研制  

Development of no-clean water-based flux for lead-free solder

作　　者：秦春阳[1] 李海普[1] 杨鹰[1] 陆文霞[1] 姜腾达[1] 

机构地区：[1]中南大学化学化工学院,湖南长沙410083

出　　处：《应用化工》2013年第10期1782-1785,1788,共4页Applied Chemical Industry

基　　金：国家军品配套项目(JPPT-125-GH-039);中南大学研究生自主探索创新项目(2013zzts173)

摘　　要：研制了一种适用于Sn-Cu系无铅焊料的免清洗助焊剂,该助焊剂以去离子水作溶剂,降低VOC物质的含量,具有绿色环保的意义,实验对活化剂、表面活性剂、助溶剂以及成膜剂等主要成分进行了优化选择,并对其性能进行了检测。结果表明,实验制备的助焊剂无卤素,固含量低于5%,焊后残留无腐蚀性,离子污染度低,符合免清洗要求,助焊性能良好,平均扩展率达到78%。A kind of no-clean flux for lead-free Sn-Cu solder was prepared. For the preparation of the flux, the deionized water was served as the solvent, and it was environmental protection because of the re- duced content of VOC. The active agents, surfactants, auxiliary solvent, and film forming emulsifiers in flu- xes were selected respectively. The composition was optimized, and the properties were tested for the flux. The results suggested that the flux is halogen free, non-corrosive of residue,low solid（ less than 5% ） and low ion contamination. The diversified properties of the no-clean flux met the standard requirements, and it achieved an excellent soldering performance and an average expansion rate of 78%.

关 键 词：无铅焊料 助焊剂 水基 焊接性能 

分 类 号：TQ421.4[化学工程]