一种谐振式MEMS压力传感器单芯片级真空封装和低应力组装方法  

A Single-Chip Vacuum Package and Low-Stress Assembling Method for Resonant MEMS Pressure Sensor

作　　者：张健[1,2] 王军波[1] 曹明威[1,2] 陈德勇[1] 

机构地区：[1]中国科学院电子学研究所传感技术国家重点实验室,北京100190 [2]中国科学院大学,北京100190

出　　处：《纳米技术与精密工程》2013年第6期492-496,共5页Nanotechnology and Precision Engineering

基　　金：北京市科技计划支持资助项目(D111100001611002)

摘　　要：为提高谐振式MEMS压力传感器的品质因数，且同时降低温度漂移，设计了一种传感器的单芯片级真空封装和低应力组装方法，选用非光敏苯并环丁烯（BCB）材料在真空加热、加压条件下实现PYREX7740玻璃空腔与传感器芯片的黏合键合，在可伐合金管座上加工出与传感器尺寸相匹配的方形空腔，实现传感器芯片的低应力组装．实验结果表明：传感器具有较高的品质因数（9455），检测范围为500—1100hPa，灵敏度为9．6Hz／，hPa，满量程最大非线性度为0．08％，-40℃-50℃内温度系数为0．9Hz／℃，温度总漂移为传感器满量程变化的1．3％，传感器在开机加电稳定后长时漂移为0．086％F．S．In order to increase the Qfactor and reduce the temperature drift of the resonant MEMS pres sure sensor, a singlechip vacuum package and lowstress assembling method for a resonant pressure sen sor was proposed in this paper. The vacuum package of the resonator and a PYREX 7740 glass with a patterned cavity was conducted by adhesive bonding using nonphotosensitive benzocyclobutene（BCB） in a vacuum heating and pressuring condition, followed by the embedding of the packaged sensor into a Kovar metal substrate with a corresponding square cavity for device lowstress assembling. Experimental results show that the Qfactor and sensitivity of the packaged resonant pressure sensor are quantified as 9 455 and 9.6 Hz/hPa, respectively, in the detection range of 500 1 100 hPa. Further performance measurement produced a maximum nonlinearity of O. 08% F.S. （5001 100 hPa） , a temperature coeffi cient ofO. 9 Hz/℃ and a total temperature drift of 1.3% F.S. （ 40 ℃-50 ℃ ） as well as a longterm drift of O. 086% F.S. in the steady working mode.

关 键 词：MEMS 谐振式压力传感器 真空封装 低应力组装 黏合键合 

分 类 号：TP212.1[自动化与计算机技术—检测技术与自动化装置]