硅微机械谐振压力传感器技术发展  

A Review of Silicon Micromachined Resonant Pressure Sensor

作　　者：苑伟政[1,2] 任森[1,2] 邓进军[1,2] 乔大勇[1,2] 

机构地区：[1]西北工业大学空天微纳系统教育部重点实验室,西安710072 [2]西北工业大学陕西省微/纳米系统重点实验室,西安710072

出　　处：《机械工程学报》2013年第20期2-9,共8页Journal of Mechanical Engineering

摘　　要：硅微机械谐振压力传感器是目前精度最高、长期稳定性最好的压力传感器之一,是航空航天、工业过程控制和其他精密测量领域压力测试的最佳选择。系统阐述30年来国内外硅微机械谐振压力传感器技术的研究成果,简单介绍硅微机械谐振压力传感器的分类及工作原理,针对压力敏感膜片与谐振器复合结构和振动膜结构两种主要的芯体结构形式,详细论述硅微机械谐振压力传感器的研究历史、主要研究机构、国内外发展现状以及最新的研究成果,重点根据不同激励与检测方式对各种硅微机械谐振压力传感器的芯体结构进行深入分析比较。在此基础上,总结归纳不同芯体结构及其激励与检测方式的特点,并对硅微机械谐振压力传感器的未来发展趋势进行展望。Silicon micromachined resonant pressure sensor is the optimum selection of pressure monitoring in aerospace, industrial process controlling and other precision measurement fields, for its high accuracy and extremely long-term stability. A review on 30 years of range silicon micromachined resonant pressure sensor development is presented, especially on the structures of various sensor chips using different excitation and detection mechanisms. Meanwhile, the classification and operating principle of silicon micromachined resonant pressure sensor are introduced, and the research history, the major research institutions, the study status and the latest research achievements are described in detail, based on two main types of sensor chip structures： Composite structure of diaphragm and resonator, and vibrating diaphragm structure. Then comparisons are made in sensor chip structures, excitation mechanisms and detection mechanisms. Prospects for the foreseeable future of silicon micromachined resonant pressure sensor is proposed.

关 键 词：微机械 谐振 压力传感器 谐振器 激励 检测 

分 类 号：TP212[自动化与计算机技术—检测技术与自动化装置]