磁控溅射制备Cu-Ta合金膜的研究  

The preparation of the Cu-Ta alloy films by magnetron sputtering

作　　者：杨宁[1] 朱雪婷[1] 尹兆益[1] 吴大平[1] 孙勇[1] 

机构地区：[1]昆明理工大学材料科学与工程学院,云南昆明650093

出　　处：《云南大学学报（自然科学版）》2013年第6期791-796,共6页Journal of Yunnan University(Natural Sciences Edition)

基　　金：国家自然科学基金(50871049)

摘　　要：室温下采用磁控共溅射法,在硅衬底上制备了Cu-Ta非晶合金膜,利用AFM(atomic force microscopy)分析观察了溅射功率及沉积时间对薄膜形貌的影响,讨论了溅射功率对薄膜硬度及弹性模量的影响.实验发现,溅射功率越大,薄膜的致密平整性越好;溅射时间越长,薄膜的粗糙度越大,平整度越差.纳米压痕测试结果表明溅射功率越大薄膜的硬度及弹性模量越大,其机械性能越好.In this research, Cu -Ta amorphous alloy films have been deposited on Si substrate by magnetron co - sputtering. The effect of sputtering power and deposition time on the films＂ morphology has been investigated by the way of atomic force microscopy technique. The sputtering power dependence on the hardness and the elas tic modulus of the films have been explored. The results reveal that the evenness and compactness of the film will be improved with the increase of the sputtering power, while the evenness of the film worsens with the increase of sputtering time. The nanoindentation experiments illustrates that the hardness and the elastic modulus of the films will increase when the sputtering power intensifies.

关 键 词：Cu-Ta非晶合金膜 磁控溅射 原子力显微镜 表面形貌 

分 类 号：TB43[一般工业技术] TN305.92[电子电信—物理电子学]