微导通孔填铜电镀的影响因素研究  

Research on Infuence Factors of Micro Through-hole Filling Copper Plating

作　　者：吴攀[1] 陈长生[1] 

机构地区：[1]中国电子科技集团公司第十五研究所,北京100083

出　　处：《电子工艺技术》2013年第6期349-351,376,共4页Electronics Process Technology

摘　　要：由于印制电路板对高密度、高精度、高可靠性及低成本的强烈需求,常规的导通孔敷形镀技术已经不能满足高密度布线的要求,所以提出了微导通孔填铜电镀和微盲孔填铜电镀技术。通过在添加剂方面对影响微导通孔填铜电镀的因素进行分析,运用正交试验的研究方法,得到了添加剂的最优组合和配比,从而实现微导通孔的较好填充。Because of the strong requirements of high-precision, high-reliability and low-cost Printed Circuit Boards（PCB）,the conventional conformal through-hole plating already cannot satisfy the requirements of high-density wiring, so put forward the micro through-hole plating copper flling and micro blind hole flling copper plating technology. Additives of factors that affect micro through-hole plating copper flling were analyzed, and using the orthogonal experiment research methods, obtained the optimal combination and proportion of additives, so that micro through-hole plating copper flling is well acquired.

关 键 词：印制电路板 填铜电镀 微导通孔 

分 类 号：TN41[电子电信—微电子学与固体电子学]