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作 者:焦晓阳[1] 刘建芳[1] 丁宁宁[1] 路崧[1]
机构地区:[1]吉林大学机械科学与工程学院,吉林长春130022
出 处:《哈尔滨工程大学学报》2013年第11期1445-1449,共5页Journal of Harbin Engineering University
基 金:国家自然科学基金资助项目(50605027);科技部科技型中小企业技术创新基金资助项目(12C26212201364)
摘 要:为了实现压电喷射点胶,使压电喷射技术能广泛地应用到电子封装产业中,设计了一种压电/气体混合驱动式非接触喷射点胶阀.介绍了该点胶阀的工作原理,利用FLUENT动网格技术分析了阀杆行程与胶液实现喷射的关系,通过实验得到了影响点胶阀点胶质量的因素.实验选用直径为0.3 mm的钨钢喷嘴,实现了5 000 mPa·s中高粘度环氧树脂胶结剂的喷射点胶,获得胶点最小直径为0.5 mm,点胶频率可达120 Hz,胶点一致性误差在5%以内.Considering that the piezoelectric materials can be used for jet microelectronics packaging, a new type of piezoelectric/gas hybrid driven dispensing and can be widely applied in non-contact jet dispensing valve has been developed. This paper expounds upon the working principles of the valve, and uses FLUENT dynamic grid technol- ogy to analyze the relationship between the valve rod stroke and the glue solution to realize dispensing. Through the experiment, the factors which affect the dispensing quality of this valve were obtained. The 5 000 mPa ~ s high vis- cosity epoxy resin glue dispensing was realized with tungsten steel which has a nozzle diameter of 0.3 mm which was selected. The results show that the minimum diameter of the glue dot is 0.5 mm, dispensing frequency reaches 120 Hz, and the consistent error rate of the glue dot is under 5%.
关 键 词:微电子封装 喷射点胶 微位移放大 压电叠堆 流场分析
分 类 号:TN405[电子电信—微电子学与固体电子学]
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