调质40Cr磁控溅射制备CrN涂层工艺优化设计  

Process Optimization Design of CrN Coating Deposited on Quenched and Tempered 40Cr Steel by Magnetron Sputtering

作　　者：王松[1] 李晖[1] 陈勇[1] 许洪斌[1] 孙迎军[1] 刘威[1] 

机构地区：[1]重庆理工大学材料科学与工程学院,重庆400054

出　　处：《重庆理工大学学报（自然科学）》2013年第12期38-43,共6页Journal of Chongqing University of Technology：Natural Science

基　　金：国家自然科学基金资助项目(51275548);重庆市自然科学基金资助项目(cstc2012jiB70002)

摘　　要：为找到合适的工艺方案,使之能通过磁控溅射在调质40Cr表面制备得到性能良好的CrN涂层,采用正交试验的方法进行试验设计及数据分析。选取氮气流量、工作真空度、靶功率、沉积时间为主要因素,将涂层表面光洁度、涂层厚度、涂层硬度、涂层与基体的结合力作为衡量标准。结果表明最佳工艺方案为:N2流量为40 sccm,工作真空度为1.2 Pa,靶功率为150 W,沉积时间为120 min。The orthogonal test was used to obtain an appropriate process scheme for depositing CrN film on the quenched and tempered 40Cr by magnetron sputtering. The N2 partial pressure, degree of vacuum, target power, deposition time were as the main factors, and the surface roughness, thick- ness, hardness, the coating and the substrate bonding force were as the reference points. The result shows that the optimal process were：N2 flow of 40 sccm, vacuum of 1.2 Pa, target power of 150 W, coated 120 min.

关 键 词：磁控溅射 CRN涂层 工艺优化 

分 类 号：TG174.453[金属学及工艺—金属表面处理]