纳米填料导电胶研究进展  

Recent Progress of Electrically Conductive Adhesives with Nano-fillers

作　　者：何鹏[1] 王君[1] 顾小龙 林铁松[1] 

机构地区：[1]哈尔滨工业大学先进焊接与连接国家重点实验室,哈尔滨150001 [2]浙江省冶金研究院有限公司浙江省钎焊材料与技术重点实验室,杭州310011

出　　处：《材料工程》2013年第12期1-7,共7页Journal of Materials Engineering

基　　金：国家自然科学基金资助项目(51105107;51021002;51275135);黑龙江省自然科学基金资助项目(QC2011C044);高等学校博士学科点专项科研基金优先发展领域课题资助(20112302130005)

摘　　要：本文从理论上分析了纳米填料在电子封装用导电胶中的作用。从纳米填料含量、粒径、形状与维度、表面状态、固化温度与固化时间等方面综述了纳米填料导电胶性能影响因素的国内外研究进展;重点介绍了纳米填料原位生成、纳米填料烧结等导电胶性能改进技术,探讨了存在的主要问题,并指出进一步提高导电导热性能、粘接强度和可靠性,制备应用于柔性封装、喷墨印刷的导电胶以及降低制备成本是未来纳米填料导电胶研究领域的发展方向。The effects of nano-fillers on electrically conductive adhesives （ECAs） applied to electronic packaging were theoretically analyzed. Research progress in influencing factors of properties of nano- filler ECAs,such as content, size, shape, surface state of nano-fillers, curing temperature and curing time etc, was reviewed. The methods for improving properties such as irrsitu synthesis of nano-fillers and sintering of nano-fillers were emphatically introduced. Main challenges of nano-filler ECAs re- search were proposed, as the improvement of ECAs properties, such as the electrically and thermally conductive performance, bonding strength and reliability, conductive flexible adhesives, ink-jet adhe- sives and cost reduction.

关 键 词：纳米材料 导电胶 影响因素 电子封装 

分 类 号：TQ43[化学工程]