LED用蓝宝石衬底抛光后湿法清洗研究  被引量:1

Study on the Post Chemical Mechanical Polishing Wet Cleaning of Sapphire Substrate Used for LED

在线阅读下载全文

作  者:卓志国[1,2] 周海[1] 施建国 冯欢[1] 

机构地区:[1]盐城工学院,江苏盐城224051 [2]常州大学,江苏常州213164 [3]安徽华菱汽车有限公司,安徽马鞍山243061

出  处:《机械设计与制造》2014年第1期151-153,共3页Machinery Design & Manufacture

基  金:江苏省自然科学基金项目(BK2008197);江苏省高校科研成果产业化推进项目(JH10-X048);江苏省"青蓝工程";江苏省新型环保重点实验室开放课题基金(AE201120);江苏省生态环境材料重点建设实验室开放课题资助(EML2012013);国际科技合作聘专重点项目的资助(G2012029)

摘  要:LED被认为是下一代主要照明工具,其以高质量的衬底基片外延GaN层,目前主要用化学机械抛光后的蓝宝石晶片作为衬底,但抛光后的衬底表面布满杂质,这些杂质会导致外延层缺陷,降低发光率甚至使器件失效。探讨了在蓝宝石衬底清洗过程中,HF、表面活性剂、氧化剂的作用。得出HF溶液对衬底表面的SiO2颗粒有很好的清除效果,不会造成蓝宝石衬底表面质量恶化,表面活性剂可以形成覆盖层降低衬底表面能,同时防止被去除杂质的再次附着,强氧化剂可以腐蚀衬底表面去除附着力较强的颗粒。在试验中通过不同清洗顺序发现表面活性剂形成的覆盖层也会对杂质产生保护作用。在使用表面活性剂后再使用HF溶液清洗,衬底表面颗粒数从18降为10,但表面存在腐蚀坑样的污染,在以表面活性剂、浓硫酸、HF溶液的清洗顺序清洗后发现表面颗粒数从20降至8,没有腐蚀坑样的污染存在,因此采用表面活性剂、浓硫酸、HF溶液的清洗顺序可以得到好的效果。Light Emitting Diode is thought as the primary illumination, which needs high-quality substrates to grow a film of GaN. Now it adopts sapphire as the substrates usually which must be processed by chemical mechanical polishing. However the substrate is covered with impurity that causes flow in epitaxial layer,reducing luminous efficiency and even destroy the tool.lt talks about work of HF, surfactant and oxidant during the wet cleaning. It is found that the solution of HF can wipe off the particle adhered to substrate well and do not worsen the surface. Suofactant can form a film on the substrate and stop particles in solution adhering to it again, and the oxidant can corrode sapphire and wipe off impurity, which has strong anchoring strength. It finds suoractant can protect pollution not to be dislodged by form a film. HF is used after the surfactant in cleaning, and the number of particle is reduced from 18 to 10 and there is pollution like etch pit on the surface. As it cleans the wafer with the order of surfactant, H2SO4,HF,and the etch pit disappears and the number is reduced from 20 to 8, so the order of surfactant,H2SO4,HF is better than others and get a good result.

关 键 词:HF 氧化剂 表面活性剂 湿法清洗 蓝宝石衬底 

分 类 号:TH16[机械工程—机械制造及自动化] TG739[金属学及工艺—刀具与模具]

 

参考文献:

正在载入数据...

 

二级参考文献:

正在载入数据...

 

耦合文献:

正在载入数据...

 

引证文献:

正在载入数据...

 

二级引证文献:

正在载入数据...

 

同被引文献:

正在载入数据...

 

相关期刊文献:

正在载入数据...

相关的主题
相关的作者对象
相关的机构对象