盘形超声压电振子的抛光实验研究  

Experimental Research on Polishing by Using Ultrasonic Vibrator of Disc Type

作　　者：何勍[1] 徐俊艳[1] 刘政[1] 

机构地区：[1]辽宁工业大学振动工程研究所,辽宁锦州121001

出　　处：《辽宁工业大学学报（自然科学版）》2013年第6期400-402,共3页Journal of Liaoning University of Technology(Natural Science Edition)

基　　金：国家自然基金项目资助(51075195)

摘　　要：应用盘形超声压电振子在抛光实验装置上对硅片进行了化学机械抛光,比较了附加行波超声振动的化学机械抛光与传统化学机械抛光的实际效果,实验结果表明,在相同的实验工况下,施加行波超声振动相对于不施加振动,能明显改善硅片化学机械抛光的表面质量。振子振幅的增大对改善硅片表面质量有利。The type of disc shape ultrasonic vibrator was used to assist chemically mechanical polishing device in polishing silicon wafers. The actual effect from polishing being assisted with travelling wave ultrasonic vibration and the chemically mechanical polishing was compared with that of conventional technique. Experiment result shows that the surface quality finished on silicon wafers polished by assisting with ultrasonic vibration is obviously improved if compared with that when no vibration is assisted. The amplitude of the vibrator increases, the surface quality of cilicon is favourable.

关 键 词：盘形压电振子 行波 超声振动 硅片 化学机械抛光 

分 类 号：TB535[理学—物理]