微电子封装超声键合机理与技术中的科学问题  

Ultrasonic Bonding in Microelectronics Packaging

作　　者：韩雷[1] 

机构地区：[1]中南大学,长沙410083

出　　处：《中国基础科学》2013年第3期14-26,F0002,F0003,共15页China Basic Science

基　　金：973计划项目(2003CB716202;2009CB724203)

摘　　要：优化高速度、高可靠的精密制造,必须深入理解制造装备进行的工艺过程的原理和细节。超声键合是复杂物理、力学作用下的封装过程,使金属材料在微米和毫秒时空中形成界面键合。2003年以来,中南大学课题组,在国家"973"计划项目的支持下,进行了超声键合机理的相关研究,获得深入的理解和工艺优化方向的认识。本文回顾了封装的发展,介绍了科学问题的产生,以及所使用的键合动力学研究手段。Optimizing a high speed, reliablible, accurate man- ufacturing process begins with a clear understanding of the detaisls of process principle. Ultrasonic and ther- mosonic bonding by automatic equipments, a packaging process driven by complicated physical and mechanical interactions, make a strength formation between two met- als at the sub-micron scale within the milliseconds range. The authors＇group at Central South University, established in 2003 under the support by the China De- partment of Science ＆ Technology Progect 973, has been doing related studies on bonding mechanism for in- depth process know-why and know-how. This paper re- views the progress of microelectronics packaging, sci- ence challenges and research methods used in bonding dynamics.

关 键 词：超声键合 微电子封装 键合动力学 973计划 

分 类 号：TP242.2[自动化与计算机技术—检测技术与自动化装置]