LTCC基板砂轮划片工艺研究  

Study of LTCC Dicing Process by Grinding Wheel

作　　者：岳帅旗[1] 束平[1] 刘志辉[1] 

机构地区：[1]中国电子科技集团公司第二十九研究所,四川成都610036

出　　处：《电子工艺技术》2014年第1期49-51,共3页Electronics Process Technology

摘　　要：通过正交试验确认了导致LTCC(低温共烧陶瓷)基板砂轮划片背面崩边的主要因素,基于对各个主要因素的分析,优化了砂轮划片方案,有效地解决了背面崩边问题,获得了高质量的划片效果。The main factors of collapse on LTCC substrate back side in dicing were recognised by using orthogonal experiment method. Based on the analysis results of the main factors, the plan for LTCC substrate dicing was optimized, by which the collapse problem was solved. High quality LTCC Substrate dicing was achieved at last.

关 键 词：低温共烧陶瓷 砂轮划片 背面崩边 

分 类 号：TN405.94[电子电信—微电子学与固体电子学]