封装体中枕头效应的翘曲模拟研究  

Simulation of warpage about head-in-pillow defect in package

作　　者：赵振宇[1] 刘磊[1] 蔡坚[1] 王豫明[1] 王谦[1] 邹贵生[1] 周运鸿[1] 朴昌用 

机构地区：[1]清华大学,北京市100084 [2]三星电子有限公司,韩国首尔市336711

出　　处：《焊接》2014年第1期13-17,68,共5页Welding & Joining

摘　　要：通过构建BGA封装体模型并对回流焊接过程中BGA封装体的翘曲进行模拟,采用粘弹性模型描述塑封材料随温度的变化而变化的性质,通过与实际封装体变形的测量结果对比发现,这种方法能够较好地模拟室温翘曲和回流焊中翘曲的动态演变过程,翘曲变形结果与实际测量值比较吻合。同时,对于不同的芯片堆叠方式进行了模拟对比,发现芯片与周围材料接触面积增加会导致翘曲值过大,芯片排布不对称性较高时会导致回流过程中的翘曲值变化量增大。A BGA package model was founded to simulate reflow process to analyze the warpage of package.The viscoelastic material model was used to describe the variation of the EMC property with temperature,the results matched well with the measured values.Meanwhile,the models with different chip stacks were built and compared.It was found that the increase of chip area contacting with surrounding materials will lead to a large warpage result.A higher asymmetry model will cause a larger warpage change.

关 键 词：球栅阵列封装 枕头效应 有限元模拟 

分 类 号：TG115.28[金属学及工艺—物理冶金]