微型线圈-铁芯结构传感器中聚酰亚胺的低成本刻蚀和平坦化方法  

Etching and Planarization Process for Polymide Used in the Micro Coil-Core Structure with Low Cost

作　　者：郭博[1] 刘诗斌[1] 段红亮[1] 杨尚林[1] 侯晓伟[1] 

机构地区：[1]西北工业大学电子信息学院,西安710129

出　　处：《传感技术学报》2013年第10期1328-1333,共6页Chinese Journal of Sensors and Actuators

基　　金：国家自然科学基金项目(60874101);高等学校博士学科点专项科研基金项目(20126102110031);西北工业大学研究生创业种子基金项目(Z2013074;Z2013075)

摘　　要：研究了预亚胺化温度、时间以及刻蚀时间对聚酰亚胺湿法刻蚀结果的影响。预亚胺化后2.5μm厚的PI-5型聚酰亚胺采用EPG 533型光刻胶作为掩膜时,预亚胺化采用90℃/5 min^140℃/10 min方案,采用1%KOH溶液,15 s的显影/刻蚀时间会得到较好的刻蚀结果。在此基础上,通过实验研究了一种低成本的填充式平坦化技术。通过在底层线圈上旋涂第1层聚酰亚胺,湿法刻蚀去除铜线上的聚酰亚胺保留间隙中聚酰亚胺,然后再旋涂第2层聚酰亚胺的方式,完成了第2层聚酰亚胺的平坦化。与直接在底层线圈上旋涂聚酰亚胺而不做平坦化处理比较,起伏高度差从1.8μm降低到150 nm,且起伏缓慢、无明显台阶。应用这种技术制备了一种采用线圈铁芯结构的微型磁通门传感器并进行了测试,传感器工作正常,性能优良。The effects of pre-imidization temperature,time and the etching time on the results of wet etching were investigated. The 2. 5μm thickness of PI-5 type polymide after pre-imidization was etched by 1% KOH solution with EPG 533 photoresist frame. The results show that baking at 90 ℃/5 min^140 ℃/10 min and development/etching for 15 s is the best design program. On this basis,a kind of low-cost filling planarization technology was investigated. Spinning a polymide layer on the bottom coil, then etching the polymide on the copper conductors and left the polymide in the gaps with wet etching,finally,a second polymide layer was spun on them. The second polymide layer will be played as a planarization layer. Under the filling planarization,the surface height difference decreased from 1. 8μm to 150 nm,and the step disappeared. A micro-fluxgate sensor with coil core structures was fabricated by utilizing this method. The sensor operated properly and presented excellent performance.

关 键 词：平坦化 湿法刻蚀 聚酰亚胺 微型磁通门传感器 

分 类 号：TQ323.7[化学工程—合成树脂塑料工业] TN405.95[电子电信—微电子学与固体电子学]