晶圆表面金属薄膜的纳米精度在线测量方法与实现  

In-situ Measurement Methods of the Metal Layer Thickness on Wafer with Nanometer Precision

作　　者：赵乾[1] 曲子濂[1] 余强[1] 路新春[1] 孟永钢[1] 

机构地区：[1]清华大学机械工程系摩擦学国家重点实验室,北京100084

出　　处：《中国基础科学》2013年第4期36-43,共8页China Basic Science

基　　金：973计划(2009CB724207);02专项(2008ZX02104-1)

摘　　要：本文主要介绍了晶圆加工中的几何参数的纳米精度在线测量的原理、方法和测量仪器研究。针对化学机械抛光(CMP)中晶圆表面的金属膜厚的高精度快速在线和离线检测技术的要求,通过数值模拟和理论分析,研究了涡流传感器的参数对其灵敏度的影响规律,得到了提高灵敏度的新方法;实验验证了一种减小提离高度对膜厚测量精度影响的测量方法的有效性,并设计开发了快速多频测试系统;设计了电涡流在线和离线检测系统,并成功应用于国家重大专项项目"超低下压力化学机械抛光装备样机"中,实现了用电涡流方法进行全自动、快速、多模式、大提离条件下的晶圆金属膜厚度纳米级分辨率在线测量和晶圆抛光后铜膜厚度离线全局测量。Measurement theory and methods of metal layer thickness on wafer with nanometer precision are stud-ied.To realize the high-accuracy and high-speed metal-lic thickness measurement , the theoretical calculation and numerical simulation are used to study the influence factors of sensitivity of eddy current sensor , and a new effective methods to increase the sensitivity and de-crease the influence of liftoff vibration has been pro-posed and experimentally demonstrated .The measure-ment system （ in-situ and off-line ） is developed and successfully applied to the chemical mechanical polis-hing instrument .The developed measurement system al-so has more potential application in the other filed , such as the nanometer near-field optics device , surface plas-mon polaritons （ SPPs ） , optical superlens and very large scale integration （ VLSI） etc.

关 键 词：涡流传感器 纳米精度金属薄膜厚度测量终点检测 化学机械抛光 

分 类 号：TH89[机械工程—仪器科学与技术]