IC封装成型过程关键力学问题  

Critical Mechanical Problems of IC Packag Molding Process

作　　者：张锋[1] 曹阳根[1] 杨尚磊[1] 陆美华 王广卉[1] 

机构地区：[1]上海工程技术大学材料工程学院,上海201600 [2]上海伊诺尔信息技术有限公司,上海201100

出　　处：《半导体技术》2014年第3期210-213,219,共5页Semiconductor Technology

基　　金：国家自然科学基金资助项目(51075256);上海市教育委员会科研创新重点项目(11ZZ177)

摘　　要：随着电子行业的发展,对IC封装过程中的Au丝变形提出越来越严格的要求,不能出现断Au丝、露Au丝以及Au丝与芯片接触的现象。基于Ansys/Workbench有限元分析软件,将流场与压力场进行耦合,针对在不同注塑压力下,对同一条带YOA2的Au丝进行应力变形分析,并且用X射线对封装后的模块进行检测。模拟结果与检测结果相比较表明:当注塑压力从6 MPa增大到8 MPa时,Au丝变形量只增大了16μm,而且Au丝变形与压力呈线性关系。采用X射线检测与CAE技术相结合,研究封装过程中Au丝受力变形,并提出相应改进方案,对改善Au丝变形具有一定意义。With the development of the electronics industry, more strict requirements are put forward on the gold wire deformation in the process of integrated circuit （IC） assembly. The fracture, bareness and contact with the chip of gold wires are forbidden. Based on finite element analysis software Ansys/W orkbench, the flow field and pressure field were coupled to analyze the deformation of the gold wire under different injection pressures on the same strip YOA2, and the IC packages module were tested by X-ray. By comparing of the simulations and the tests, the results show that the deformation of the gold wire increases only 16 u.rn when the injection pressure increases from 6x 106 Pa to 8x 106 Pa, and the gold wire deformation has a linear relation with the pressure. Using X-ray testing and CAE technology to study the deformation of gold wire in the packaging process, and the improvement project was put forward, being of great significance to improve the deformation of gold wire.

关 键 词：IC封装 计算机辅助工程(CAE) 压力 金线偏移 

分 类 号：TN405[电子电信—微电子学与固体电子学]