IC高密度陶瓷外壳串扰对信号完整性的影响  

Impact of Crosstalk on Signal Integrity of High Density Ceramic Package for IC

作　　者：蒋纬[1] 郑宏宇[1] 赵祖军[1] 

机构地区：[1]中国电子科技集团公司第十三研究所,石家庄050051

出　　处：《半导体技术》2014年第3期220-225,232,共7页Semiconductor Technology

摘　　要：在高密度陶瓷封装外壳设计中,遇到的包括单信号线的延迟、反射和多信号线间的串扰等噪声问题,以及电源完整性问题,这些问题都严重影响整个电子系统性能的信号完整性。基于高速电路传输线的信号完整性相关基本理论,通过测试和仿真的方法来研究传输线间近端串扰和远端串扰问题。对大规模集成电路外壳CQFP240M进行串扰测试分析,利用仿真软件CST建立微带线和带状线模型,仿真、测试分析相邻传输线间串扰大小的影响因素。根据仿真结果,提出降低串扰的方法,优化设计,提高传输结构性能。In the design of high density ceramic packages, the noise problems such as delay and reflections of the single line, and the crosstalk between the line and the problem of power integrity seriously affected the performances of whole electronic system. Based on basic theory of the signal integrity at high-speed circuit transmission line, the problems of the transmission line between near-end crosstalk and far-end crosstalk were studied by using the methods of test and simulation. The crosstalk at large scale integrated circuit package CQFP240M was analyzed. Microstrip and stripline model were built by simulation software CST, and the influence factors of crosstalk between adjacent transmission lines were simulated and tested. Acording to the simulation results, the crosstalk reduction method is put forward, the design is optimized and the transmission structure performances are improved.

关 键 词：信号完整性 串扰 集成电路 陶瓷封装 仿真 

分 类 号：TN402[电子电信—微电子学与固体电子学]