铝合金表面磁控溅射Cu膜的镀制及其低温钎焊性能研究  

Low Temperature Soldering of Al Alloy Modified with Sputtered and Ion Implanted Cu Coatings

作　　者：杨波[1] 田修波[1] 巩春志[1] 

机构地区：[1]哈尔滨工业大学先进焊接与连接国家重点实验,哈尔滨150001

出　　处：《真空科学与技术学报》2014年第2期153-157,共5页Chinese Journal of Vacuum Science and Technology

基　　金：国家自然科学基金项目(51175118和10975041)

摘　　要：针对铝合金无法直接烙铁钎焊的问题,本文提出了一种表面改性焊接的新方法:采用离子注入与磁控溅射相结合的技术在2024铝合金表面制备Cu膜,并实现了铝合金的低温钎焊。实验中通过改变基体偏压,研究不同参数对Cu膜的沉积速率、表面形貌、相结构以及低温钎焊性能的影响。结果表明:随着偏压幅值的增大,Cu膜的沉积速率逐渐下降,表面粗糙度先降低后增大,Cu膜呈现出较强的(111)择优取向;Cu膜的镀制改善了铝合金的低温钎焊性能,当偏压为-300 V时,所得钎焊接头剪切强度可达24.47 MPa,接头断口微观形貌呈现出局部拉长且方向一致的韧窝。A novel technique was developed to solder the Al alloy at a low temperature. In the newly-developed technique, the surfaces of the 2024 AI alloy were modified with the Cu coatings synthesized by magnetron sputtering and ion implantation. The impacts of the deposition conditions, including the substrate bias, deposition rate, gas flow rate, and etc, on the interfacial adhesion of the Cu coating and soldering quality were evaluated. The Cu coatings were characterized with X-ray diffraction, scanning electron microscopy, and atomic force microscopy. The results show that the Cu-coating significantly improves the soldering conditions of the Al alloy, and that the bias strongly affects the （111） preferentiallyoriented, Cu coating. As the bias increased, the Cu deposition rate decreased, and the surface roughness changed in a decrease-increase mode. For instance, grown at-300 V, the maximum shear strength at the soldered joints were found to be 24.47 MPa, with locally elongated ripples along the shear force direction at the fracture.

关 键 词：铝合金 磁控溅射 CU膜 低温钎焊 

分 类 号：TG454[金属学及工艺—焊接] TB79[一般工业技术—真空技术]