SMO-8封装器件的焊接可靠性  

Soldering Reliability of the SMO-8 Package Device

作　　者：魏爱新[1] 刘晓红[1] 王志会[1] 

机构地区：[1]中国电子科技集团公司第十三研究所,石家庄050051

出　　处：《半导体技术》2014年第4期300-304,314,共6页Semiconductor Technology

摘　　要：SMO-8陶瓷管壳封装的器件在焊接到印制板作温度冲击试验后,管壳底部的陶瓷层出现了裂纹。使用ANSYS有限元分析的方法对管壳焊接到印制板的整体结构的应力分布情况进行仿真分析,找出陶瓷出现裂纹的力学原因。并据此提出SMO-8陶瓷管壳焊接的改进方案:SMO-8管壳接地焊盘由方形设计改为边缘圆弧形设计,然后重新做应力分析。通过对比,在相同温度条件下管壳陶瓷层所受应力分布改善,边沿所受应力值明显降低。根据仿真结果制作样品并对样品做温度冲击试验进行验证。结果表明,圆弧形焊盘设计可以解决SMO-8封装器件焊接后经温度冲击时出现的陶瓷层裂纹问题。After the temperature shock experiment, some cracks appeared on the ceramic layer of SMO-8 device soldered on PCB （printed circuit board）. In order to solve the problem, using ANSYS fi- nite element analysis method, the stress distribution of the whole structure of the printed board soldered with the tube was simulated and analyzed. The mechanical factor of the crack was identified, and the improved method of soldering SMO-8 ceramic case was put forward, the design of SMO-8 device grounding pad was changed from square shape to arc shape, and then the stress distribution was analyzed with the new pad again. By contrast, at the same temperature, the stress distribution of ceramic layer was improved, and the stress of the ceramic edge was decreased dramatically. The samples were made according to the simulation results, and the samples were verified by the temperature shock experiment. The results show that the arc pad design could solve the ceramic layer crack problem of soldered SMO-8 device during temperature shock.

关 键 词：封装 可靠性 失配 瓷裂 有限元分析 焊盘 

分 类 号：TN305.94[电子电信—物理电子学]