电子封装功率模块PbSnAg焊层热循环可靠性  

Reliability of PbSnAg solder layer of power modules under thermal cycling in electronic packaging

作　　者：张胜红[1] 王国忠[1] 程兆年[1] 

机构地区：[1]中国科学院上海冶金研究所,上海200050

出　　处：《中国有色金属学报》2001年第1期120-124,共5页The Chinese Journal of Nonferrous Metals

摘　　要：对电子封装IGBT功率模块进行热循环实验 ,考察了 92 .5Pb5Sn2 .5Ag钎料焊层的热循环失效和裂纹扩展。应用超声波显微镜对裂纹扩展过程进行检测 ,得到了热循环失效的裂纹扩展数据。采用统一型粘塑性Anand方程描述了 92 .5Pb5Sn2 .5Ag的力学本构 ,模拟了功率模块钎料焊层裂纹体在热循环条件下的应力应变。基于对ΔJ积分的求解 ,描述了PbSnAg焊层热循环裂纹扩展速率。By applying thermal cycling tests to the IGBT power modules, the thermal fatigue and crack propagation of 92.5Pb5Sn2.5Ag solder layer were investigated. The crack propagation process in solder layer was inspected with C mode scanning acoustic microscope (CSAM) and the crack propagation data were also measured. By employing the unified viscoplastic Anand constitutive equation to represents the deformation behavior of 92.5Pb5Sn2.5Ag solder, the stress/strain responses of the power modules with crack in PbSnAg solder layer under thermal cycling were simulated with finite element method. Moreover, the crack propagation rate of PbSnAg solder layer under thermal cycling was described based on the calculation of mechanical parameter Δ J integral. [

关 键 词：钎料 热循环 裂纹扩展 粘塑性 △J积分 可靠性 电子封装 

分 类 号：TN305.93[电子电信—物理电子学]