SiC_p表面化学镀铜工艺研究  

Study on the Process of Electroless Copper Plating on SiC_p

作　　者：陈曙光[1] 丁厚福[1] 郑治祥[1] 刘君武[1] 

机构地区：[1]合肥工业大学材料科学与工程学院,安徽合肥230009

出　　处：《热加工工艺》2001年第1期28-30,共3页Hot Working Technology

摘　　要：Si Cp 因其高强度、高模量、耐热、耐磨、耐高温等性能而被作为颗粒增强体制备金属基复合材料。本文用正交法优化了 Si Cp 表面化学镀铜工艺 ,获得了 Cu包覆 Si Cp,测定了 Si Cp 的增重百分率及镀液的 p H值随时间的变化规律 ,并对镀覆层形貌进行了 SEM考察。结果表明 ,镀液的 p H值及 Ni2 +浓度对镀速影响最为显著 ;粒子分散很好。Because of its excellent properties, such as high strength, high module, wear resisting, etc, SiC p is added to metal-matrix composite as a reinforce particle. In this present work, the process of electroless copper plating on SiC p was optimized with orthogonal experiments, and SiC p covered with electroless copper coating was obtained. The relationship between the increasing mass percentage of SiC p, the pH value of the bath and the time was studied, meanwhile, the surface morphology of deposited coating was measured by scanning electron microscope (SEM). As the results show, the pH value and the concentration of Ni 2+ have a strong influence on the deposition rate, the particles are fine dispersed, and the surface of deposited coating is uniform.

关 键 词：化学镀铜 碳化硅 金属基复合材料 

分 类 号：TB333[一般工业技术—材料科学与工程] TQ153[化学工程—电化学工业]